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AI-Ready, Efficient, Scalable Rack-Level Cooling For AI & HP 

USystems ColdLogic Rear Door Heat Exchangers (RDHx) provide high-density, rack-level cooling by removing heat directly at the source within server racks and cabinets. Operating on a warm closed-loop water circuit, RDHx delivers exceptional thermal performance without added complexity or specialized infrastructure.  

Designed for ultra-high-density environments, including AI and high-performance compute (HPC), ColdLogic RDHx systems replace or significantly reduce traditional room-based cooling while delivering 90kW to 150kW of cooling per cabinet. As a practical supplement to direct-to-chip cooling, RDHx enables scalable, space-efficient deployments of both liquid and standard cooling in IT racks and cabinets.    

ColdLogic RDHx is ideal for both new builds and retrofits. It delivers meaningful CapEx and OpEx savings of up to 86% compared to mechanical cooling, while achieving industry-leading PUEs as low as 1.035 even in high-performance configurations. 

Key Benefits

CL20 Rear Door Heat Exchanger

A versatile, single-source RDHx solution supporting low-, medium-, and high- density racks, delivering up to 90kW per cabinet while maximizing floor space by eliminating hot and cold aisle requirements.


A high-performance RDHx engineered for AI and HPC workloads, delivering up to 150kW per rack with unmatched efficiency, controlling the room environment without the need for additional cooling infrastructure.


The CL20 Rear Door Heat Exchanger is now backed by a verified PEP EcoPassport®, delivering independently validated lifecycle environmental data in accordance with internationally recognized standards. Built with 28% recycled content, RoHS-compliant, and designed for responsible end-of-life recycling, it minimizes environmental impact from installation through disposal.

Learn more about our cabinet and containment solutions through our resource page, where you can download success stories, data sheets, white papers, and watch videos.